Pioneer Engineering in Thin-Film Technologies

Founded in 1991 by a group of Dresden-based engineers, FHR Anlagenbau GmbH is an innovative company focused on vacuum process technology and special plant construction. Using their many years of experience in thin film technology, our engineers create both state-of-the-art solutions for thin film applications and tailor-made plant designs.

 

Our core skills in thin-film technology

•   Reactive and non-reactive magnetron sputtering, vapour deposition under vacuum, CVD and PECVD processes for highly efficient deposition of metals, oxides and nitrides.

•   Plasma-enhanced etching technologies for surface treatment and ultra-efficient material removal (high-rate etching).

•   Atomic layer deposition for cutting ultra-thin functional layers of homogenous layer thickness on complex 3D-surface structures

 

Our core skills in special plant construction

•   Cluster systems for the treatment and coating of small-area substrates and wafers

•   Roll-to-roll systems for the coating of foils and flexible substrates (web coating)

•   Inline systems for large-area deposition and coating of architectural glass plates

•   ALD reactors for atomic layer deposition

•   Plasma sources and gas regulation systems

•    Sputter targets, individually made and bonded to cooling bodies

 

 

FHR Technologies

Magnetron sputtering

Thin films made of sputtered cathode material

•    Deposition of metals, alloys, oxides and nitrides

•    Reactive and non-reactive magnetron sputtering techniques

 

Sputter deposition is a thin-film technology which is classified as a physical vapour deposition (PVD) method. The material which is to be deposited (target material) is first sputtered (atomised) by way of ion bombardment in a plasma and thereby transformed to the vapour phase. The particle vapour is then deposited as a thin film on the substrate to be coated

 

FHR is a global technological leader in the field of sputter deposition. We offer you special know-how for reactive and non-reactive magnetron sputtering processes using DC, pulsed DC, MF and HF power supplies. Those sputter technologies which fit the customer needs best depending on type of materials used, desired layer properties and deposition rates will be integrated into tailor-made coating systems.

Sputter technology integration options

 

Cluster systems

Roll-to-roll systems

Inline systems

 

Typical applications for magnetron sputtering

•    Semiconductor

•   OLED displays

•   MENS & NEMS

•    Optics

•    Architecture glass

•    Photovoltaics

•    Solar thermals

 

Thermal vapour deposition

Functional layers of condensed particle vapour

•    Allows very high deposition rates

•    Individual material mix thanks to the possibility of co-evaporation

 

Thermal vapour deposition under vacuum is a physical vapour deposition (PVD) technology, just like sputter deposition (magnetron sputtering). Whereas the transition of the coating material to the vapour phase is caused by ion bombardment in magnetron sputtering, thermal vapour deposition means that specially designed heaters heat up the coating material so that it evaporates (liquids) or sublimates (solids). The thus generated particle vapour is then deposited on the substrate to be coated.

 

Among the different PVD thin-film technologies, thermal vapour deposition allows particularly high deposition rates to be achieved, depending on coating material and desired layer properties. In order to guarantee our customers optimum process parameters for vapour deposition, we fit our products out individually with particularly suited evaporation sources (crucibles or saggars, line or jet evaporators, or custom-made evaporators).

 

Thermal vapour deposition integration options

Cluster systems

Roll-to-roll systems

Inline systems

 

Typical applications for thermal evaporation

•    Semiconductor
•    Sensors
•    MEMS & NEMS